ERPUG 2015 Presentations from Budapest, HungaryThe third ERPUG conference had 86 participants from 21 countries.1 History of Road Profile Measurements and Current Standards in Road Surface Characteristics Leif Sjögren, VTI, SE2 HiSpeq, Specifications and Requirements in Road Surface Measurements Alex Wright, TRL, UK3 ProVAL – a Longitudinal Profile Analysis Tool and Its Historical Development with Smoothness Specifications George Chang, Transtec, US4 Introduction of Pavement Management and Monitoring Technologies in Japan Dr. Chikakuni Maeda, Pasco, JAP5 Possible use of RST road surface data in Hungary Gábor Major, T7, HU6 Road Monitoring and Assessment in Germany – an overview Tanja Altemeier, Bast, DE7 News from LEHMAN + Partner Alexander Bock, Lehman + Partner, DE8 Runway Pavement Roughness Considering Pavement Surface Drainage and Boeing Bump Index (Roughness Index) Injun Song, SRA, US9 Challenges for Correlating Aircraft Simulator Results with ISO Indicies Albert Larkin, SRA, US10 Tunnel and Side Area Scanning with ViaPPS Hårvard Farstad, Viatech, NO11 News from RAMBÖLL Peter Ekdahl, Ramboll, SE12 Macro and Micro Texture Performance of Cement Concrete Pavement Surfaces Bencze Zsolt, KTI, HU13 MPD/IRI Transverse Position Thomas Lundberg, VTI, SE14 MPD/IRI Transverse Position Olle Eriksson, VTI, SE15 Automated Ravelling Inspection and Maintenance Planning on Porous Asphalt in the Netherlands and its Future plan P. Schackmann, P. Paffen, RWS/TNO, NL16 Using 3D transverse profiles and IMUs to measure road geometry and t o generate high-resolution DTM models of pavement surfaces John Laurent, Pavemetrics, CA17 Results from the project Rosanne, rolling resistance, road noise and friction measurements Roland Spielhofer, AIT, AUT18 25-year pavement surface monitoring of 60 trial sections László GÁSPÁR, KTI, HU19 Emerging Technologies from the Other Side of the Pond Lauren Tran, Pathway Services, US20 News from VIAGROUP Alfred Weninger, ViaGroup, AUT21 Road Doctor Survey Van and Pavement Diagnostics Jan Filipovsky, Roadscanners, FI22 Thermal imaging and compaction Peter Ekdahl, Ramboll, SE